Failure-free integrated circuit packages : systematic elimination of failures through reliability engineering, failure analysis, and material improvements

Rok: c2005
ISBN: 9780071434843
OKCZID: 110190434

Citace (dle ČSN ISO 690):
COHN, Charles, ed. a HARPER, Charles A., ed. Failure-free integrated circuit packages: systematic elimination of failures through reliability engineering, failure analysis, and material improvements. New York: McGraw-Hill, c2005. xix, 363 s. McGraw-Hill professional engineering.

Anotace

SPOT, STOP, AND ANALYZE IC DEVICE FAILURE WITH THIS UNIQUE ILLUSTRATED GUIDE Worth more than a thousand words, each illustration in Failure- Free Integrated Circuit Packages gives you a visual reference on common failure modes of IC devices in organic packages. In addition, the wide knowledge base of the chapter authors provides you with proven, leading-edge failure analysis techniques. Failure-Free Integrated Circuit Packages helps you: * Find, identify, and correct potential failures before they occur * Improve device reliability * Learn from case studies of IC package failure modes * Quickly locate failures through visual comparisons * Apply state-of-the-art failure analysis techniques * Comprehend the physics behind the failure mechanism * Understand the limitations of reliability testing and lifetime estimation INSIDE, YOU’LL FIND A PRACTICAL AND EASY WAY TO APPROACH FAILURE ANALYSIS OF ICs IN ORGANIC PACKAGES. AREAS COVERED INCLUDE: Fundamentals of IC package technologies Reliability Physics and chemistry of failures in packaged devices Strategies for locating failures Failure analysis techniques Failure modes common in organic IC packages Emerging assembly materials for IC packaging

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